F&S Elektronik Systeme

What is it the Open Standard Module (OSM)™?
OSM™ is a standardized format for embedded modules defined by the SGET (Standardization Group for Embedded Technologies) consortium. This standard aims to overcome the limitations of traditional module formats, offering an optimal solution for direct integration on PCB (Printed Circuit Board). Thanks to this technology, OSM™ embedded modules are connector-free and use LGA (Land Grid Array) contacts, making them particularly suitable for high-density applications and in contexts where space is a critical constraint.

The OSM™ is based on compact formats ranging from 15x15 mm up to 45x45 mm, making them extremely flexible in terms of design. The modules support a wide range of processors, such as NXP i.MX, thus offering advanced computing power and low power consumption, ideal for embedded and IoT applications.
F&S has focused on the production and manufacturing of modules in 30x30 mm format (small format).

Advantages of OSM™

Cost reduction:

Thanks to the standardized format, the development process of new embedded solutions is simpler and faster, allowing companies to bring products to market in less time and at lower costs.

Compatibility:

The modules support popular operating systems such as Linux and FreeRTOS, ensuring a stable and proven platform for mission-critical applications.

Flexibility:

OSM™ modules are designed to adapt to different types of applications, from the simplest to those requiring greater computational capabilities, thanks to different configurations in terms of processors and memory.

Product Detail

SolderCore™ Modules: Compact and Powerful Solutions
In addition to the OSM™ modules, F&S Elektronik Systeme offers the SolderCore™ module range, a compact and integrated solution that stands out for its connector-free design. The SolderCore™ modules measure just 35x35 mm and also use LGA technology for direct connection to the PCB, eliminating the need for external connectors. This design makes the module particularly suitable for areas where limited space is crucial, such as IoT, industrial applications and multimedia embedded systems.

SolderCore™ modules integrate NXP i.MX series processors, known for their energy efficiency and processing power, and offer a wide range of interfaces to connect to external peripherals, including USB, Ethernet, CAN bus, SPI, I²C and GPIO. Thanks to this versatility, the modules can be used in a wide range of applications, from industrial automation to energy management to edge computing.

Main Applications Embedded modules based on OSM and SolderCore™ find application in various sectors, including:

Internet of Things IoT:

Thanks to their compact size and advanced communication capabilities, these modules are ideal for connected devices such as sensors, remote monitoring devices and control units.

Industrial Automat.:

The modules offer the robustness and flexibility needed to integrate into industrial machinery, control systems and production management solutions.

Automotive:

In the automotive sector, the use of OSM and SolderCore™ modules allows the development of advanced control units for vehicles with smart functions and infotainment systems.

Medical Devices:

Embedded modules can be integrated into medical devices for monitoring and controlling patient conditions, thanks to their small size and energy efficiency.

Product Detail