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F&S Elektronik Systeme

Features
  • Small Size 50x40mm
  • One Robust Connector Only
  • up to 1GHz Cortex-A9
  • SLC NAND Flash: 32MB up to 1GB
  • Interfaces: 1-2 Ethernet, USB Host/ Device, LCD/Touch, CAN, I2C,...
PicoCOM

Con PicoCOM, F&S vuole offrire quante più interfacce standardizzate possibili, tutte completamente supportate dal sistema operativo integrato. Ciò consente un rapido sviluppo del software applicativo. L'intera gestione dell'alimentazione della CPU è già fornita a bordo e la scheda viene collegata alla carrier board del cliente tramite un robusto connettore a 80 poli. Sono necessari solo alcuni driver di interfaccia aggiuntivi (RS232, trasformatore Ethernet). Tutti i moduli di questa famiglia hanno le stesse dimensioni (40x50 mm) ed utilizzano lo stesso connettore, dove la prima metà dei pin trasporta segnali fissi e la seconda offre interfacce specifiche del modulo. Pertanto, è possibile in qualsiasi momento aggiornare ad un modulo più recente della stessa famiglia (aggiornamento a moduli con maggiore potenza di elaborazione e più memoria, nonchè aggiornamento a moduli successivi e più economici).

 PicoCOM1PicoCOM1.2PicoCOM4PicoCOMA5PicoCOMA9XPicoCOMA7
Stateno new developmentsProductionno new developmentsProductionProductionProduction

CPU

CPUATMELNXP i.MX 6Samsung ARM 926, 400 MHzNXP VybridNXP i.MX 6NXP i.MX 6ULL
CoreARM 926 EJARM Cortex-A7ARM 9Cortex-A5 + Cortex-M4ARM Cortex-A9 + Cortex-M4ARM Cortex-A7
No of CoresUltraliteSingle-/Dual-CoreSoloX1
Frequency210 MHzmax. 696MHz400 MHzmax. 500MHz + 167 MHzmax. 1GHz + 200 MHzmax. 900MHz
L2-Cache128KB512kB256KB128KB
GPUNEONNEON
FPU
NEON
FPU
VideoCPUCPU, 2D

Operating System

AndroidLollipop 5.1.1
Linux2.6 (Emlix Eval/ Pro)
(uboot installed)
Buildroot/Yocto
(uboot installed)
2.6.37
(uboot installed)
Buildroot
(uboot installed)
Buildroot
Yocto
(uboot installed)
Buildroot
(uboot installed)
WindowsWCE 6.0 R3
(Bootloader installed)
WEC 2013
(Bootloader installed
WCE 6.0 R3
(Bootloader installed)
WCE 6.0 R3
WEC 7
WEC 2013
(Bootloader installed)
WEC 7
WEC 2013
(EBoot installed)
WEC 7
WEC 2013
(Bootloader installed)
Real TimeMQXFreeRTOS

Memory

Flash32MB+max. 1GB SLC NAND64MB+max. 1GBmax. 1GBmax. 512MB NAND
RAM32MB+max. 512MB64MB+max. 512MBmax. 512MBmax. 1GB

Interfaces

SD-Cardextern1x externexternextern1x extern1x extern
Ethernet10/ 100MB10/100Mb10/ 100MB2x 10/100MB
IEEE 1588
1-2x 10/100Mb
IEEE 1588
1-2 10/100MB IEEE1588
USB Host1-2 (2.0 FS)1x1-2 (1.1 FS)1-21x1x
USB Device0-1 (2.0 FS)1x0-1 OTG (2.0 HS) listed within starter kit as RS232/ RS48511x1x
CAN12x11-21-2x1-2x
UART1x with modem signal, baudrate 115200
1x with RTS/ CTS, max. baudrate 115200
1x mit max. baudrate 115200
6x1x with RTC/ CTS, max. baudrate 115200
1x with RTS/ CTS, max. baudrate 115200
1x with max. baudrate 115200
32-3x3x
I2C12x11-21x1-2x
SPIopt.2xopt.11x1x
Audio1x Audio Codec Line Out (L/ R)
1x Audio Codec Line In (L/ R)
3x Analog In (10Bit resolution)
Line In/Out/analog1x Audio Codec Line Out (L/ R)
1x Audio Codec Line In (L/ R)
Line In/OutLine In/OutLine In/Out
Digital I/Omax. 48max. 48
Touch Panel4-wire, analogue resistive4-wire, analogue resistive; PCAP-Touch via I2C4-wire, analog resistive
PCAP-Touch via I2C
4-wire, analog resistive PCAP-Touch via I2C
RTCexternal IC
additional Interfaces4x 12Bit ADC (opt.)

Display

RGB16/18bit16/18bit16/18 Bit
LVDSexternexternexternal

Common

Supply Voltage+3,3V+3,3V DC/ ±5%+3,3V+3,3V DC/ ±5%+3,3V DC/ ±5%+3,3V DC/ ±5%
Power Consumption1W typ.2W typ.1,5W typ.
Operating Temperature-20°C - +85°C0°C - +70°C
opt. -25°C - +85°C
0°C - +70°C (-20°C - +85°C (optional))0°C - +70°C
opt. -20°C - +85°C
0°C - +70°C
opt. -40°C - +85°C
0°C - +70°C
opt. -25°C - +85°C
Size40x50 mm40x50 mm40x50 mm40x50 mm40x50 mm40x50 mm
Weight~15g~10g~15g~15g
Long Term Availability2030202320302031
All above marks and product names are property of own manufacturers. Specifications subject to changes without notice.