Iscriviti alla Newsletter per rimanere sempre aggiornato sulle novità del mondo Display ed Embedded Solutions! Iscriviti

F&S Elektronik Systeme

  1. Home
  2. Prodotti
  3. F&S
  4. efus™

efus™

Features
  • 47x62mm
  • Single Voltage 5V
  • RGB/LVDS/DVI
  • MXM2 Goldfinger Connector, 230 Pins, 0,5mm
  • Camera, PCIe, SATA, WLAN, BT
efus
easystarterkit
workshop
customized WEC2013/Linux
free support
functionalvarious interfaces
expandable with wireless modules
easy base board
universalvisualization
communication
control
smallsize of 47x62mm only
5V power supply
  efus™A7UL efus™A9 efus™A9X efus™MX8X efus™MX8MP
State Production Production Production Samples Production
CPU
CPU NXP i.MX 6UL/ULL NXP i.MX 6 NXP i.MX 6SoloX NXP i.MX 8DualX/ QuadXPlus NXP i.MX 8Dual/ Quad Mini Plus
Core ARM Cortex-A7 ARM Cortex-A9 ARM Cortex-A9 + Cortex-M4 ARM Cortex-A35 + -M4 ARM Cortex-A53 + -M7
No of Cores 1 1, 2, 4 1 + M4 2x, 4x A35 + M4F 2x, 4x A53 +M7
Frequency max. 900MHz max. 1GHz max. 1GHz + 200MHz 1.2GHz 1.8GHz + 800MHz
L2-Cache 128KB max. 1MB 256KB 512KB (ECC) 512KB
GPU - 2D, 3D 2D, 3D 2D, 3D (GC7000 Lite, 4 shader) 3D/2D, ES 3.1/3.0, CL™ 1.2, VG™ 1.1,
Machine Learning ML
VPU - 1080p60 - 4Kp30 1080p60, h.265/4, VP9, VP8,
Video Encode: 1080p60, h.265/4
Operating System
Android - - Lollipop 5.1.1 - -
Linux Buildroot
Yocto
(uboot installed)		 Buildroot
Yocto
(uboot installed)		 Buildroot
Yocto
(uboot installed)		 Buildroot/Yocto
(uboot installed)		 Yocto
(uboot installiert)
Windows WEC 2013
(Bootloader installed)		 WEC 7
WEC 2013
(Bootloader installed)		 WEC 2013
(Bootloader installed)		 - -
Real Time - - FreeRTOS FreeRTOS FreeRTOS
Memory
Flash max. 512MB
max. 32GB eMMC		 max. 512MB
max. 32GB eMMC
opt. SPI NOR
opt.I2C EEPROM		 max. 512MB
max. 32GB eMMC		 max. 512MB QSPI NAND
1MB QSPI NOR
max. 64GB eMMC		 max. 512MB QSPI NAND
max. 64GB eMMC
eMMC - max.32GB - - -
RAM max. 1GB max. 2GB max. 2GB LPDDR4 32 bit max. 8GB LPDDR4
Interfaces
SD-Card 2x extern 2x extern 2x extern external max. 2x extern
Ethernet 2x 10/100Mb 100/1000Mb 2x 100/1000Mb 2x 100/1000Mb (IEEE 1588, AVB) 2x 100/1000Mb
WiFi IEEE802.11b/g/n/ac* - IEEE802.11 b/g/n/ac* 802.11ac/a/b/g/n 802.11ac/a/b/g/n
BT BT 2.1/ EDR 3.0/ 4.1 LE
with antenna socket
opt. chip antenna		 - BT 2.1+EDR 4.0/4.1
with antenna socket
opt. chip antenna		 5.0 LE with antenna socket 5.0 LE with antenna socket
USB Host 1x 1x 1x 1x USB 2.0 OTG 1x USB 3.0 OTG
USB Device 1x 1x 1x 1x USB 3.0 OTG 1x USB 2.0 OTG
CAN 2x 2x 2x 2x CAN-FD 2x CAN-FD
UART 6x 4x 4x 4x 4x
I2C 4x 2x 2x 4x 2x
SPI 4x 2x 2x 2x 2x
Audio I2S I2S I2S I2S I2S
Touch Panel analog resistive and PCAP Touch ext. via I2C analog resistive and PCAP Touch via I2C analog resitive and PCAP Touch ext. via I2C analog resistive and PCAP Touch ext. via I2C analog resistive and PCAP Touch ext. via I2C
Camera analog/digital 0/parallel 8bit 0/MIPI-CSI or Parallel 8bit 1/Parallel 8bit 0/MIPI-CSI2/ Parallel 8bit 0/ MIPI-CSI2
PCIe - 1x 1x 1x PCIe 3.0 (1 lane) 1x PCIe 3.0 (1 lane)
SATA - 1x - - -
RTC on board/ external IC on board/ external IC on board/ external IC on board/ external IC on board/ extern IC
Display
RGB 18/24bit 18bit 18bit - 18 Bit
LVDS opt. 18bit LVDS via MXM2 2x 24bit 1x 24bit
opt. 1x 18bit LVDS via MXM2		 2x 24bit
(max.1080p)		 2x 24bit
(max.1080p)
CRT/DVI - 0/DVI - - -/FullHD
MIPI-DSI - - - 2x 4 lanes
(max. 2x1080p)		 -
Common
Supply Voltage +5VDC/ ±5% +5VDC/ ±5% +5VDC/ ±5% +5VDC/ ±5% +5VDC/ ±5%
Power Consumption 1-2W typ. 2-4W typ. 2W typ. 3W typ. 3W typ.
Operating Temperature 0°C - +70°C
opt. -20°C - +70°C
-40°C - +85°C		 0°C - +70°C
opt. -20°C - +85°C		 0°C - +70°C
opt. -20°C - +85°C		 0°C - +70°C
-20°C - +70°C
-40°C - +85°C		 0°C - +70°C
-20°C - +70°C
-40°C - +70°C
Size 47x62.1x11mm
(LxBxH)		 47x62.1x11mm
(lxbxd)		 47x62.1x11mm
(lxbxd)		 47x62.1x11mm
(LxBxH)		 47x62.1x11mm
(LxBxH)
Weight ~15g ~15g ~15g ~15g ~15g
Long Term Availability 2031/2035 2035 2035 2035 2035
All above marks and product names are property of own manufacturers. Specifications subject to changes without notice.